Wenesco Soldering Equipment


[Home]  [About Wenesco]

Wenesco has a long history of producing standard and custom made wave solder pots and systems for the Electronics and Automotive industries.

These devices include wave solder fountains for PCB soldering, Mini-Wave solder pots for selective soldering, custom wave solder pots for continuous wire tinning, and heavy duty lead- free wave solder pots for soldering automotive radiators and battery cables

We also produce special wave solder systems for soldering stators and armatures


Wave solder pots

standard and custom made for selective soldering, dipping and tinning, basic wave soldering systems.

Wave rework solder pots

for desoldering. Remove and replace lead-thru components from PCBs



For successful wave soldering, it is important that component leads and base metals both reach an effective soldering temperature as close as possible to the same heating rate

The effective temperature is the temperature necessary to assure metallurgical bonding of the solder alloy and the base metals to be soldered.

Metallurgical bonding during wave solder requires that both surfaces to be soldered reach the proper soldering temperature for a sufficient time to allow the wetting of the solder surfaces and the formation of intermetallic compound(s) of the base metal(s) with one or more constituents of the solder alloy.

Minimum soldering temperature is usually 25C above the melting temperature of the solder alloy. The solder joint on a given assembly that reaches the minimum soldering temperature last is typically underneath one of the most massive components.

Wave soldering requires controlled rates of heating. Heavy multilayer PCBs can be damaged without preheat, as well as components.

It is very important, for these reasons, the wave solder pot should be capable of accurate temperature control.

Therefore, when profiling assemblies for wave solder, the following areas should be closely monitored

Ramp Up: The rate of temperature increase controlled to ensure the PWB, components and flux have sufficient time to reach soldering temperature without degradation.

Thermal Spike: Thermal spike is measured to ensure components are not exposed to excessive heat during the solder cycle.

Mini wave solder pots are sometimes used for soldering small components and tinning coil leads at elevated temperatures These mini fountains, up to 900F, are made to order


Wenesco, Inc.
4700 W. Montrose Avenue, Chicago, Illinois, 60641  USA

Telephone (773) 283-3004.      Toll-free: (800) 233-4430.      FAX: (773) 283-3787

Email:  esales@wenesco.com 
 Or fill in Form
Por Favor Comuniquese con Juan Hernandez : (773) 283-3004, ext 16

All Contents 1998-2015, Wenesco, Inc                                                                                                                    Developed by The Web Author