Wenesco Hot Plates For Wafer Manufacturing
Models HP66V, HP1212QPV3
Wenesco Models HP66V and HP1212QPV3 are precision-engineered vacuum hot plates designed for semiconductor wafer processing, probing, characterization, and thermal curing applications. These custom-drilled vacuum hot plates use high-uniformity heaters and accurate digital temperature controls to maintain consistent thermal performance across the entire plate surface.
The vacuum chuck securely holds wafers in place while embedded temperature sensors continuously monitor and regulate process temperatures for repeatable results.
These systems support lift pins for contact or proximity baking, heat-cool functionality, and gas-tight hood configurations for controlled processing environments.
Wenesco vacuum hot plates improve throughput by integrating heating and cooling operations while supporting demanding applications such as semiconductor inspection, failure analysis, surface annealing, metal deposition, and advanced material research.
Wenesco welcomes your inquiry regarding other sizes and shapes.
Vacuum Chuck Hot Plates
Wenesco Vacuum Chuck Hot Plates provide a highly controllable thermal processing solution for wafer heating during probing, testing, and inspection applications.
Each system features a remote digital thermostat positioned up to 32 inches from the plate, with digital temperature display options in Celsius or Fahrenheit and temperature stability maintained within 1% of the selected set point.
The heated vacuum chuck secures wafers using vacuum suction while optional pneumatic lift pins support automated or programmed wafer handling cycles.
Vacuum rings and ports can be enabled or disabled with recessed set screws, giving operators greater process flexibility for semiconductor manufacturing, laboratory testing, and precision thermal processing environments.
Wenesco welcomes your inquiry regarding other sizes and shapes.
Wenesco 3-Zone Hot Plates
Wenesco 3-Zone Hot Plates are designed for wet bench, proximity bake, and hard-bake semiconductor wafer processing applications requiring precise multi-zone temperature control.
The HP4TV 3-Zone Vacuum Chuck features anodized aluminum plate construction with hermetically sealed stainless steel housing to protect internal electric and electronic systems in demanding production environments.
Each 4-inch heating zone operates independently using programmable digital thermostats with a temperature range of 29C to 375C and accuracy within 1% of set point.
Adjustable lift pins raise wafers for controlled processing cycles before lowering them into vacuum-sealed contact with the plate, while an integrated buzzer alerts operators when processing is complete.
Wenesco welcomes your inquiry regarding other sizes and shapes.
| Model | Plate Size (in) | Overall Size (in)* | Vacuum Rings | Plate Surface. Flat to .005 | Power |
|---|---|---|---|---|---|
| HP66V | 6 X 6 | 8 X 8 X 2 high | pv3 or pv4 | Aluminum/anodized | 120/240 |
| HP99V | 9 x 9 | 11 x 11 x 2 | pv3 or pv4 | aluminum/anodized | 120/240 |
| HP1212V | 12 x 12 | 14 x 14 x 2 | select | aluminum/anodized | 120/240 |
| HP1818V | 18 X 18 | 20 x 20 x 2 | select | aluminum/anodized | 120/240 |
| HP2424V | 24 X 24 | 26 x 26 x 2 | select | aluminum/anodized | 240 |
| Model | Plate Size (in) | Overall size (in)* | Vacuum Rings | Plate Surface. Flat to .005 | Power |
|---|---|---|---|---|---|
| HP66HV | 6 x 6 | 10 x 10 x 5 | pv3 or pv4 | Stainless 303 | 120/240 |
| HP99HV | 9 x 9 | 13 x 13 x 5 | pv3 or pv4 | Stainless 303 | 240 |
| HP1212HV | 12 x 12 | 16 x 16 x 5 | select | Stainless 303 | 240 |
| HP1818HV | 18 x18 | 22 x 22 x 5 | select | Stainless 303 | 240 |
| Model | Plate Size (in) | Overall size (in)* | Vacuum Rings | Plate Surface. Flat to .005 | Power |
|---|---|---|---|---|---|
| HP66NV | 6 X 6 | 8 X 8 X10 high | pv3 or pv4 | aluminum/anodized | 400 |
| HP99NV | 9 x 9 | 11 x 11 x 10 | pv3 or pv4 | aluminum/anodized | 400 |
| HP1212NV | 12 x 12 | 14 x 14 x 10 | select | aluminum/anodized | 400 |
| HP1818NV | 18 X 18 | 20 x 20 x 10 | select | aluminum/anodized | 400 |
| HP2424NV | 24 X 24 | 26 x 26 x 10 | select | aluminum/anodized | 400 |
| Model | Plate Size (in) | Overall size (in)* | Vacuum Rings | Plate Surface. Flat to .005 | Power |
|---|---|---|---|---|---|
| HP66HNV | 6 x 6 | 10 x 10 x 12 | pv3 or pv4 | Stainless 303 | 537 |
| HP99HNV | 9 x 9 | 13 x 13 x 12 | pv3 or pv4 | Stainless 303 | 537 |
| HP1212HNV | 12 x 12 | 16 x 16 x 16 | select | Stainless 303 | 537 |
| HP1818HNV | 18 x18 | 22 x 22 x 16 | select | Stainless 303 | 537 |
| HP2424HNV | 24 x 24 | 28 x 28 x 16 | select | Stainless 303 | 537 |
Model HP1818 NV, shown here, has a tall gas-tight hood with nitrogen gas entering from the top. Operations (Nitrogen flow on,off )( Heat on, off) (Hood up, down), are controlled with an optional timer. The optional light tower displays activation of these functions. The polished stainless steel plate is 18 x 18 inches, and operates at 450C
Interior view of motorized lift pin assembly. This version is controlled with a computer.
Model HP66V, with nitrogen hood removed, is shown with style pv3 vacuum pattern. The plumbing delivers and retrieves coolant through tunnels machined in the chuck. Chuck temperature is reduced from 300C to room temperature in approximately 25-30 minutes.
Model HP1212HVÂ is shown with a gas tight hood, fitted with a high temperature glass window. This fully insulated hood is 4 in above the heated chuck. The vented base shown under the heated chuck housing contains a motorized lift pin assembly. Lift pin speed is controlled up and down.
Multi-Wafer Lift Pin Hot Plates
This model is designed for proximity and soft baking. A computer manages the step motor, which raise and lowers up to 10 wafers in one cycle. Position, speed, and dwell are precisely controlled.
Process temperature is controlled with a digital thermostat up to 400C in a nitrogen environment. The cabinet and hood are made from stainless steel.
The heated anodized plate measures 18 x24 inches, and a vacuum hood is available for hard bake.
Model H0909AA5AV21Â includes a 9X9 inch vacuum chuck with a PV4 vacuum ring pattern, The insulated hood is sealed to contain a nitrogen atmosphere which is introduced through diffuser ports. The four lift pins rate and position, are infinitely controlled using a stepper motor. Temperature is uniformly controlled with an accurate digital thermostat which may be accessed from your computer. The entire hot plate assembly is contained in a paneled stainless steel housing.”
Model HP99VAC
This 9X9″ hot plate features an insulated hood ready for connection to your vacuum pump. The hood is designed to hold a vacuum up to -25 PSI (1.72 bar)
Frequently Asked Questions
What are Wenesco hot plates used for in wafer manufacturing?
Wenesco hot plates provide precise temperature control for semiconductor wafer processing applications such as soft bake, hard bake, annealing, probing, testing, inspection, and material characterization.
How do vacuum chuck hot plates improve wafer processing?
Vacuum chuck hot plates securely hold wafers in place using vacuum suction, ensuring stable positioning during heating. This improves temperature uniformity, process consistency, and overall product quality.
What temperature accuracy do Wenesco wafer hot plates provide?
Wenesco wafer hot plates use digital temperature controls that maintain temperatures within 1% of the selected set point, helping manufacturers achieve repeatable and reliable thermal processing results.
What are the benefits of lift pins on wafer hot plates?
Lift pins allow wafers to be positioned above the heated surface for contact or proximity baking before lowering them into place. This feature supports automated processing, reduces handling risks, and improves throughput.
Can Wenesco hot plates be customized for semiconductor applications?
Yes. Wenesco designs custom hot plate solutions with options such as vacuum chucks, multi-zone heating, cooling capabilities, gas-tight hoods, programmable controls, and application-specific configurations to meet unique semiconductor manufacturing requirements.