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Wenesco Wave Type Re-Work

Concept 5, Concept 6

This Concept 5 and This Concept 6 wave type re-work systems are designed for precision removal of long connectors from multilayer PCBs.

This Concept 5 removes connectors up to 6 inches long, while This Concept 6 handles connectors up to 14 inches long with controlled solder flow and localized heating for sensitive electronic assemblies.

Both systems feature a ceramic-coated interior for standard or lead-free alloys, a digital thermostat maintaining temperatures up to 350°C (662°F), and a variable speed dual-mode pump for a dross-free wave.

Additional features include a radiant preheater, slide rails, laser-guided nozzle positioning, footswitch-activated timer control, stainless steel housing with adjustable feet, one standard nozzle, and an optional blow-out hand gun for clearing holes after component removal.

Wenesco welcomes your inquiry regarding other sizes and shapes.

MODELMAX NOZZLE SIZEPOWERPREHEATERMAX PCBSOLDER LBS
CONCEPT 56 X 1 IN2000W - 120 OR 240 V6 X 6 IN8 X 665
CONCEPT 614 X 2 IN3000W - 240V12 X 18 IN12 X 18130

The integrated radiant preheater reduces flow cycle time and lowers overall temperature requirements when re-working multilayer PCBs. Preheating activates flux before soldering and minimizes thermal shock that can cause warpage, thru-hole damage, or delamination, while the precision mini-wave nozzle directs controlled solder flow to the lead pattern with minimal heat transfer to surrounding components.

Frequently Asked Questions

This Concept 5 is designed to remove connectors up to 6 inches long, while This Concept 6 supports connectors up to 14 inches long for larger PCB assemblies.

These wave type re-work systems are designed for multilayer printed circuit boards commonly used in electronics manufacturing, aerospace, defense, and industrial applications.

The radiant preheater reduces thermal shock by gradually heating the PCB before solder flow begins. This helps prevent board warpage, thru-hole damage, and delamination during component removal.

Yes. The ceramic-coated interior is compatible with both standard and lead-free solder alloys used in modern PCB manufacturing processes.

The component is positioned above a mini-wave nozzle matched to the lead pattern. Controlled solder flow heats the thru-hole connections, allowing the component to be removed while minimizing heat transfer to surrounding areas.

Standard Wave Type Re-Work

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