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Wenesco Layout & Details on Nitrogen Inerting Systems

System Components

T

Nitrogen Source

Nitrogen tank (or plant nitrogen supply) with regulator and gauge.

F1

Pump Inerter Flow Meter

Flow meter for the PUMP INERTER is usually set for 5–10 CFH. The pump inerter is used specifically to eliminate black powdery oxides produced around the pump shaft.

F2

Wave Inerter Flow Meter

Flow meter for the WAVE INERTER controls nitrogen flow into porous tubes (LF) which produce laminar flow across the (N) wave nozzle. This prevents oxides from forming on the wave surface in certain applications. Note that the nozzle is HIGHER than the tubes.

The nitrogen first enters the wave (CB) control box, where you may opt to permit nitrogen flow only when the solder pump is operating. The flow meter setting depends on the size of the nozzle. We estimate 50 CFH on the average.

F3

Pot Inerter Flow Meter

Flow meter for the POT INERTER controls nitrogen flow to the surface of the solder bath, eliminating most of the dross on the solder surface. The flow meter setting depends on the size of the hole (H) in the top cover (TC).

Estimate 15–20 CFH loss per square inch of exposed solder surface.

Estimating Nitrogen Loss

Nitrogen Loss from the Pump

Approximately 5–10 CFH.

Nitrogen Loss from the Pot

The exposed surface around the solder nozzle is the space allowed for the solder from the solder nozzle to spill back into the pot through the top cover.

Example: If the nozzle is 1″ × 4″ (4 sq. inches), the hole in the top cover will be 2″ × 5″ (10 sq. inches). 10 sq. inches less 4 sq. inches = 6 sq. inches of exposed solder surface. Nitrogen loss from the pot is therefore estimated at 6 × 15 CFH = 90 CFH.

Nitrogen Loss from the Wave Nozzle

There is a provision in the control to initiate nitrogen flow only when wave solder flow is activated. Nitrogen remains on only as long as the wave solder is flowing. Covers to minimize nitrogen loss may be used to further minimize loss. The design of these covers, of course, is dictated by the parameters of the soldering application.