Wenesco Hot Plates For Wafer Manufacturing
Hot plates with
-
Vacuum chucks: custom-drilled.
-
Chucks fitted with gas-tight hoods.
-
Lift pins for contact or proximity baking.
-
Heat-cool feature.
Custom-drilled Vacuum hot plates
-
Chucks fitted with gas-tight hoods.
-
Lift pins for contact or proximity baking.
-
Heat-cool feature.
Wenesco's hot vacuum chuck utilizes high uniformity heaters controlled with an accurate digital thermostat to assure even heating across the entire plate. The wafer is secured to the plate surface when air is suctioned out of the vacuum chuck. The temperature sensor, embedded in the vacuum chuck, monitors and maintains the selected temperature, thus controlling the cure rate of fluid materials deposited on the substrate or wafer.
A hot vacuum chuck system may also include provisions for cooling the substrate after hardening, by shutting down the heat and directing a cooling gas flow towards the emulsion. This process integrates both the hardening and cooling operations and improves product throughput.
Other applications include probing, characterization, inspection and failure analysis of semiconductor wafers and chips, surface annealing, metal disposition, baking, and other material research.
Our Standard drilled aluminum plates are flat to +/- .005 in.
We can grind to +/- .00125 in. as an option.
(Right) Model HP66V hot plate with PV4 vacuum chuck.
(Left) Model HP1212QPV3 hot plate, with four independent PV3 plate styles. This feature is available with any plate style for chucks up to 24 x 24 in.
Vacuum Chuck Hot Plates
These versatile heated chucks provide a means for a simple, yet highly- controllable heat process for heating wafers to spec temperature during probing or testing. All models feature a remote digital thermostat, which may be placed up to 32 in. from the plate. Set point and current temperature are digitally displayed in C or F, and temperature is held constant within 1% of set point. An on-off valve is furnished for your vacuum supply. Vacuum rings and port are easily enabled or disabled with recessed set screws.
(Left) Model HP99V shown with optional pneumatic lift pins. The pins can be actuated manually, or programmed using a time or temperature base.
Lift pins are further explained near the bottom of this page
Wenesco 3-Zone Hot Plates
(Left) Model HP4TV 3-Zone Vacuum Chuck is designed for wet bench, proximity, or hard -bake process of semi-conductor wafers.
The operator of this unique vacuum chuck places the wafers on the raised lift pins, which are set for desired height and time cycle. At the end of the cycle the wafers are lowered and sealed with the vacuum. A buzzer signals the operator when the cycle is complete.
The plate material is anodized aluminum. Electric and electronic systems are inside a hermetically-sealed stainless steel housing. Each 4-inch diameter zone is controlled by its own programmable digital thermostat with a range of 29C-375C and temperature accuracy of 1% of set point.
(Below) Plate Style PV3
(Below) Plate Style PV4
(Below) Plate Style PV6
(Below) Plate Style PV8
(Above) Model HP1212HV is shown with a gas tight hood, fitted with a high temperature glass window. This fully insulated hood is 4 in above the heated chuck. The vented base shown under the heated chuck housing contains a motorized lift pin assembly. Lift pin speed is controlled up and down.
(Above) Interior view of motorized lift pin assembly. This version is controlled with a computer.
(Above) Model HP1818 NV, shown here, has a tall gas-tight hood with nitrogen gas entering from the top. Operations (Nitrogen flow on,off )( Heat on, off) (Hood up, down), are controlled with an optional timer. The optional light tower displays activation of these functions. The polished stainless steel plate is 18 x 18 inches, and operates at 450C
(Above) Multi-Wafer Lift Pin Hot Plates
This model is designed for proximity and soft baking. A computer manages the step motor, which raise and lowers up to 10 wafers in one cycle. Position, speed, and dwell are precisely controlled.
Process temperature is controlled with a digital thermostat up to 400C in a nitrogen environment. The cabinet and hood are made from stainless steel.
The heated anodized plate measures 18 x24 inches, and a vacuum hood is available for hard bake.
(Above) Model HP66V, with nitrogen hood removed, is shown with style pv3 vacuum pattern. The plumbing delivers and retrieves coolant through tunnels machined in the chuck. Chuck temperature is reduced from 300C to room temperature in approximately 25-30 minutes.
(Above) Model H0909AA5AV21 includes a 9X9 inch vacuum chuck with a PV4 vacuum ring pattern, The insulated hood is sealed to contain a nitrogen atmosphere which is introduced through diffuser ports. The four lift pins rate and position, are infinitely controlled using a stepper motor. Temperature is uniformly controlled with an accurate digital thermostat which may be accessed from your computer. The entire hot plate assembly is contained in a paneled stainless steel housing."
(Left) Model HP99VAC
This 9X9" hot plate features an insulated hood ready for connection to your vacuum pump. The hood is designed to hold a vacuum up to -25 PSI (1.72 bar)
Return to directory of all hot plates by clicking HERE