Wenesco Wave Soldering Pots

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Industrial Wave Soldering Pots

Wenesco has a long history of producing standard and custom made wave solder pots and systems for the Electronics and Automotive industries. These devices include wave solder fountains for PCB soldering, Mini-Wave solder pots for selective soldering, custom wave solder pots for continuous wire tinning, and heavy duty lead- free wave solder pots for soldering automotive radiators and battery cables. We also produce special wave solder systems for soldering stators and armatures.

Wenesco Wave Solder Pots

One of Wenesco's most important product lines is Standard and Custom-made Wave Solder Pots for many commercial and industrial applications. We offer several options for varied applications, such as special nozzles, level switches, solder feeders, and nitrogen inerting. Our wave solder pots will work with standard and lead-free solder.

Wenesco Wave Rework Solder Pots

Include an adjustable radiant preheater which greatly reduces the time and temperature requirement during the flow cycle when working with multilayer PCBs.

Preheat activates flux prior to soldering and eliminates thermal shock which may otherwise cause localized warpage, thru-hole damage, and delamination.

Components are positioned over the mini-wave nozzle which matches the lead pattern of the component.

Controlled solder flow to the thru-hole pattern transmits minimal heat to the leads.

After extraction, holes are cleared with low pressure air, then a new component is inserted and soldered.

Wenesco Static Solder Pots

An alternate method for soldering circuit boards.

ALL WENESCO SOLDER POTS ARE CERAMIC COATED FOR OPERATION WITH STANDARD OR LEAD-FREE ALLOYS.

Soldering circuit boards in a shallow pot dates back to the 1950's and is still a reliable method of low volume soldering of PCB's.

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GENERAL TECHNICAL INFORMATION

For successful wave soldering, it is important that component leads and base metals both reach an effective soldering temperature as close as possible to the same heating rate.

The effective temperature is the temperature necessary to assure metallurgical bonding of the solder alloy and the base metals to be soldered.

Metallurgical bonding during wave solder requires that both surfaces to be soldered reach the proper soldering temperature for a sufficient time to allow the wetting of the solder surfaces and the formation of intermetallic compound(s) of the base metal(s) with one or more constituents of the solder alloy.

Minimum soldering temperature is usually 25C above the melting temperature of the solder alloy. The solder joint on a given assembly that reaches the minimum soldering temperature last is typically underneath one of the most massive components.

Wave soldering requires controlled rates of heating. Heavy multilayer PCB’s can be damaged without preheat, as well as components.

It is very important, for these reasons, the wave solder pot should be capable of accurate temperature control.

Therefore, when profiling assemblies for wave solder, the following areas should be closely monitored

Ramp Up: The rate of temperature increase controlled to ensure the PWB, components and flux have sufficient time to reach soldering temperature without degradation.

Thermal Spike: Thermal spike is measured to ensure components are not exposed to excessive heat during the solder cycle.

Mini wave solder pots are sometimes used for soldering small components and tinning coil leads at elevated temperatures These mini fountains, up to 900F, are made to order

SELECTIVE SOLDERING SYSTEMS

Wenesco Inc Selective Soldering Systems - Wave Solder Pots

(Below/Left) WENESCO AUTOSLIDE 6A is a fully-programmable system utilizing a PLC for a wide variety of soldering applications.

PROGRAMMABLE FUNCTIONS INCLUDE:

  • Slide conveyor speed and direction.

  • Slide conveyor stop location and duration.

  • Wave solder pot temperature.

  • Solder wave on-off duration.

  • Solder wave height.

  • Flux on-off duration.

  • Flux wave height (wave fluxer).

  • Preheater temperature.

 

The system shown is a simple pcb soldering machine.

  1. The pcb is placed into the adjustable board holder on the slide conveyer.

  2. The slide conveyor transports the board through the flux, preheat and wave solder to the end position.

  3. The soldered board is removed, and the slide is returned to the start position.

DIMENSIONS: 36 in wide, 24 in deep, 22 in high.

This system requires 2000 W.  Select 120 or 240V

COMPONENTS SHOWN:

SLIDE RAIL:MODEL SR19 as shown is set for reduced speed over the preheater.

WAVE SOLDER POT:MODEL M04E2, for lead-free solder and other alloys. A digital thermostat controls the temperature up to 320C. The 6 x 1 in wave is variable from 0 to .250 in high. The pot holds 65 lbs solder.

RADIANT PREHEATER:MODEL PMX66

FOAM FLUXER:MODEL C79-6 is made from 304 stainless steel. The foam head is 6 x 2 in. Foam is controlled with an air pressure regulator.

OPTIONS

  • Nitrogen-inerted wave solder pot.

  • Custom made solder nozzles and fixturing

  • Wave Fluxer.

  • Longer slide rail to accommodate boards up to 6x12 in

Layout and details on Nitrogen Inerting Systems HERE 

Foam & Wave Fluxers + Flux Stones HERE 

Preheaters HERE 

Solder Feeder HERE 

Dross Prevention HERE 

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