Wenesco Wave Type Re-Work

Include a radiant preheater which greatly reduces the time and temperature requirement during the flow cycle when working with multilayer PCBs. Preheat activates flux prior to soldering and eliminates thermal shock which may otherwise cause localized warpage, thru-hole damage, and delamination. Components are positioned over the mini-wave nozzle which matches the lead pattern of the component. Controlled solder flow to the thru-hole pattern transmits minimal heat to the leads. After extraction, holes are cleared with low pressure air, then a new component is inserted and soldered.